Semiconductor package and method of manufacturing the same

ABSTRACT

A semiconductor package is provided. The semiconductor package includes a carrier, a die, a metal sheet and a molding compound. The die is disposed on the carrier. The metal sheet has a first portion and a second portion, wherein a receiving space is defined by the first portion and the second portion, and the second portion is electrically connected to the carrier. The molding compound covers the die and the receiving space is filled by at least part of the molding compound.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates in general to a semiconductor package and a methodof manufacturing the same, and more particularly to a semiconductorpackage having a molding compound to cover a die and a method ofmanufacturing the same.

2. Description of the Related Art

Along with the development of semiconductor technology, a semiconductorpackage having a small size has been highly emphasized. Generallyspeaking, shrinking the size of the semiconductor package is the currenttrend. However, as more and more components are disposed on a substrateof the semiconductor package to provide multi-functions, the size of thesemiconductor package is hard to be reduced.

Take a semiconductor package having a substrate disposed with aninductor thereon for an example. In order to have higher inductancevalue, the size of the inductor has to be larger. As a result, morespace of the substrate is occupied, hence increasing the size of thesemiconductor package correspondingly.

Therefore, how to shrink the size of the semiconductor package is one ofmain topics for related manufactures.

SUMMARY OF THE INVENTION

The invention is directed to a semiconductor package and a method ofmanufacturing the same which has the advantage of reducing the size ofthe semiconductor package and the cost of the semiconductor package.

According to an aspect of the present invention, a semiconductor packageis provided. The semiconductor package includes a carrier, a die, ametal sheet and a molding compound. The die is disposed on the carrier.The metal sheet has a first portion and a second portion, wherein areceiving space is defined by the first portion and the second portion,and the second portion is electrically connected to the carrier. Themolding compound covers the die and the receiving space is filled by atleast part of the molding compound.

According to another aspect of the present invention, a method ofmanufacturing a semiconductor package includes: forming a metal sheethaving a first portion and a second portion, wherein a receiving spaceis defined by the first portion and the second portion; disposing themetal sheet on a carrier having a die disposed thereon and electricallyconnecting the second portion to the carrier; and forming a moldingcompound to cover the die and fill the receiving space.

Other objects, features, and advantages of the invention will becomeapparent from the following detailed description of the preferred butnon-limiting embodiments. The following description is made withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a semiconductor package according to a first embodiment ofthe present invention.

FIG. 1B shows a top view of the semiconductor package in FIG. 1A.

FIG. 2A shows a perspective view of the metal sheet in FIG. 1.

FIGS. 2B and 2C show examples of metal sheets with different shapes.

FIGS. 3A˜3F show a method of manufacturing the semiconductor package inFIG. 1.

FIG. 4 shows a semiconductor package according to a second embodiment ofthe present invention.

FIG. 5 shows a top view of a semiconductor package according to a thirdembodiment of the present invention.

FIG. 6 shows a top view of a semiconductor package according to a fourthembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION First Embodiment

Referring to FIG. 1A and FIG. 1B, a semiconductor package according to afirst embodiment of the present invention is shown in FIG. 1A, and a topview of the semiconductor package in FIG. 1A is shown in FIG. 1B. Thesemiconductor package 100 includes a carrier 110, a die 120, a metalsheet 130 and a molding compound 140. The die 120 is disposed on thecarrier 110. The metal sheet 130 has a first portion 131 and a secondportion 132. A receiving space 130 a is defined by the first portion 131and the second portion 132, and the second portion 132 is electricallyconnected to the carrier 110. The molding compound 140 covers the die120 and the receiving space 130 a is filled by at least part of themolding compound 140.

The semiconductor package 100 will be further elaborated in thefollowing. In the present embodiment of the invention, the metal sheet130 further has a third portion 133, by which the receiving space 130 ais further defined. The receiving space 130 a is filled by the moldingcompound 140, and the molding compound 140 covers the metal sheet 130,so that the metal sheet 130 is embedded into the molding compound 140.As the molding compound 140 is formed to protect the die 120, the metalsheet 130 embedded in the molding compound 140 only needs the space forthe pads 111 and 112, by which the second portion 132 and the thirdportion 133 are electrically connected to the carrier 110.

Moreover, the metal sheet 130 can function as a component, for example,an inductor, to replace the component wholly disposed on the surface ofthe carrier 110. Take the metal sheet 130 as an inductor for an example.If an inductor with a higher inductance value is needed, the size of themetal sheet 130 embedded in the molding compound 140 can be increasedwithout occupying additional space of the carrier 110. As a result, theintegration of the semiconductor package 100 can be increased so as toshrink the size of the semiconductor package 100.

Referring to FIG. 2A, a perspective view of the metal sheet in FIG. 1 isshown. The first portion 131 is substantially perpendicular to thesecond portion 132 and the third portion 133 to define the receivingspace 130 a. The first portion 131 has several metal bars M. The metalbars M are substantially coplanar. An angle θ between the two adjacentmetal bars M is smaller than 180 degrees, for example, about 90 degrees.In this example shown in FIG. 1B and FIG. 2A, the metal bars M form anS-shaped structure. If the length L of the metal sheet 130 needs to beincreased to increase the inductance value, more metal bars M can beused without increasing the space of the carrier 110 occupied for themetal sheet 130, that is, the space for the pads 111 and 112.

One end of the second portion 132 and one end of the third portion 133are connected to the pads 111 and 112, respectively, so that the metalsheet 130 is electrically connected to the carrier 110. In the presentembodiment of the invention, a surface treatment can be applied on thepads 111 and 112 according to the type of the carrier 110 so as toimprove surface properties. For example, when the carrier 110 is aleadframe, a surface of each of the pads 111 and 112 can be coated withsilver. Or, when the carrier 110 is a substrate, the surface of each ofthe pads 111 and 112 can be coated with nickel/gold.

The metal sheet 130 having the first portion 131 and the second portion132 can be formed in other shapes. Referring to FIGS. 2B and 2C,examples of metal sheets with different shapes are shown. In both FIGS.2B and 2C, the first portions 131′ and 131″ are spiral metal bars. Morespecifically, in FIG. 2B, the metal sheet 130′ has the first portion131′ being a spiral square and a second portion 132′ with one end shapedfor being contacted to the pad. In FIG. 2C, the metal sheet 130″ has thefirst portion 131″ being a spiral circle and a second portion 132″ withone end shaped for being contacted to the pad. The metal sheets 130′ and130″ can function as a component, such as an antenna. When the metalsheet 130′ having the second portion 132′ is intended to be electricallyconnected to the carrier 110, only one pad is needed to be disposed onthe carrier 110 for being connected to the end of the second portion132′. If the metal sheets 130′ and 130″ is intended to function as aninductor, third portions (not shown) are needed for the metal sheets130′ and 130″ and two pads on the carrier are needed.

Moreover, in the present embodiment of the invention, the first portion131 is located above the die 120. Generally, the die 120 and the carrier110 are electrically connected to each other through wires 170. The peakof each wire 170 is closer to the first portion 131. In order to avoidthe peak of each wire 170 touching the first portion 131, a distance Dbetween the first portion 131 and a top surface of the die 120 should bedesigned. For example, the distance D is preferably greater than 4 mil.

Furthermore, in order to be electrically connected to other substrate,the semiconductor package 100 can further include several solder balls160 disposed on a bottom of the carrier 110.

In the embodiment of the present invention, the semiconductor package100 can be manufacturing by a method including the following steps.Referring to FIGS. 3A˜3F, a method of manufacturing the semiconductorpackage 100 in FIG. 1 is shown.

First, the metal sheet 130 having the first portion 131 and the secondportion 132 is formed. The receiving space 130 a is defined by the firstportion 131 and the second portion 132. The metal sheet 130 can beformed by the following steps. Referring to FIG. 3A, a top view of ametal plate 302 is shown. First, part 304 of a metal plate 302 isremoved to form the first portion 131, the second portion 132, and thethird portion 133. Then, as shown in FIG. 3B, the metal plate 302 isbent along lines L1 to L4 so that the receiving space 130 a defined bythe first portion 131, the second portion 132, and the third portion 133is formed, so as to form the metal sheet 130 whose side view is shown inFIG. 3C. The step of removing the part of the metal plate can be, forexample, performed by etching or dry etching.

Next, as shown in FIG. 3D, the metal sheet 130 is disposed on thecarrier 110 having the die 120 disposed thereon and the second portion132 is electrically connected to the carrier 110. In the presentembodiment of the invention, the first portion 131 is disposed above thedie 120. The metal sheet 130 is disposed to connect the ends of thesecond portion 132 and the third portion 133 to the pads 111 and 112,respectively.

After that, as shown in FIG. 3E, the molding compound 140 is formed tocover the die 120 and fill the receiving space 130 a. In the step offorming the molding compound 140, the molding compound 140 can be formedto cover the metal sheet 130 so as to embed the metal sheet 130 into themolding compound 140 to save space of the carrier 110.

Preferably, as shown in FIG. 3F, the method of manufacturing thesemiconductor package 100 further includes the step of disposing thesolder balls 160 on the bottom of the carrier 110. Therefore, thesemiconductor package 100 can be electrically connected to othersubstrates through the solder balls 160.

In another example of a semiconductor package, the third portion 133 canbe omitted based on the function of the metal sheet 130. For example, ifthe metal sheet 130 is intended to function as an antenna, the thirdportion 133 can be omitted, and only one pad 112 on the carrier 110 isneeded. In further another example, the metal sheet 130 can be exposedfrom the molding compound 140.

Second Embodiment

Referring to FIG. 4, a semiconductor package according to a secondembodiment of the present invention is shown. The semiconductor package200 includes a carrier 110, a die 120, a metal sheet 230 and a moldingcompound 140. Compared to the semiconductor package 100 according to thefirst embodiment, the metal sheet 230 of the semiconductor package 200is disposed on the carrier 110 and beside the die 120. Therefore, thesemiconductor package 200 can also achieve the similar advantages of thesemiconductor package 100.

In addition, compared to the steps of the method of manufacturing thesemiconductor package 100, the step of disposing the metal sheet 230according to the second embodiment is different. More specifically, themetal sheet 230 is disposed beside the die 120. Other steps of themethod according to the second embodiment which are similar to those ofthe method according to the first embodiment will not be repeatedlydescribed herein.

Third Embodiment

Except the semiconductor packages 100 and 200 according to the firstembodiment and the second embodiment, a semiconductor package 500according to another embodiment can have several metal sheets as long asthe metal sheets are embedded in the molding compound, as shown in FIG.5. For example, one metal sheet 530 can be of the S-shaped structure,and another metal sheet 531 can be of the spiral square. The metalsheets 530 and 531 both are disposed beside the die 520 and in themolding compound 540.

Fourth Embodiment

Referring to FIG. 6, a semiconductor package 600 according to a fourthembodiment of the present invention is shown. The semiconductor package600 has a metal sheet 630 of the spiral square. The metal sheet 630 isdisposed in the molding compound 640. Part of the metal sheet 630 isdisposed near one side of the die 620, and another part of the metalsheet 630 is disposed near another side of the die 620.

According to the semiconductor package and the method of manufacturingthe same disclosed in the above embodiments of the invention, the metalsheet is embedded in the molding compound, so that size of the carrieris reduced and the size of the semiconductor package is also reduced.Furthermore, the cost of the semiconductor package is lowered.

While the invention has been described by way of example and in terms ofa preferred embodiment, it is to be understood that the invention is notlimited thereto. On the contrary, it is intended to cover variousmodifications and similar arrangements and procedures, and the scope ofthe appended claims therefore should be accorded the broadestinterpretation so as to encompass all such modifications and similararrangements and procedures.

1. A semiconductor package, comprising: a carrier; a die disposed on thecarrier; a metal sheet having a first portion and a second portion,wherein a receiving space is defined by the first portion and the secondportion, and the second portion is electrically connected to thecarrier; and a molding compound covering the die and the receiving spaceis filled by at least part of the molding compound.
 2. The semiconductorpackage according to claim 1, wherein the first portion has a pluralityof metal bars, an angle between the two adjacent metal bars is smallerthan 180 degrees, and the metal bars are substantially coplanar.
 3. Thesemiconductor package according to claim 1, wherein the first portion isa spiral metal bar.
 4. The semiconductor package according to claim 1,wherein the first portion is located above the die.
 5. The semiconductorpackage according to claim 1, wherein the metal sheet is disposed on thecarrier and beside the die.
 6. The semiconductor package according toclaim 1, wherein the first portion is substantially perpendicular to thesecond portion.
 7. The semiconductor package according to claim 1,wherein the carrier has a pad, and an end of the second portion isconnected to the pad.
 8. The semiconductor package according to claim 7,wherein the carrier is a leadframe, and a surface of the pad is coatedwith silver.
 9. The semiconductor package according to claim 7, whereinthe carrier is a substrate, and a surface of the pad is coated withnickel/gold.
 10. The semiconductor package according to claim 1, whereina distance between the first portion and a top surface of the die isgreater than 4 mil.
 11. The semiconductor package according to claim 1,further comprising: a plurality of solder balls disposed on a bottom ofthe carrier.
 12. The semiconductor package according to claim 1, whereinthe metal sheet functions as an antenna.
 13. The semiconductor packageaccording to claim 1, wherein the metal sheet functions as an inductor.14. The semiconductor package according to claim 1, wherein the moldingcompound covers the metal sheet.
 15. A method of manufacturing asemiconductor package, comprising: forming a metal sheet having a firstportion and a second portion, wherein a receiving space is defined bythe first portion and the second portion; disposing the metal sheet on acarrier having a die disposed thereon and electrically connecting thesecond portion to the carrier; and forming a molding compound to coverthe die and fill the receiving space.
 16. The method according to claim15, wherein the step of forming the metal sheet comprises: removing partof a metal plate to form the first portion and the second portion; andbending the metal plate so that the receiving space defined by the firstportion and the second portion is formed.
 17. The method according toclaim 16, wherein the step of removing the part of the metal plate isperformed by etching.
 18. The method according to claim 16, wherein thefirst portion has a plurality of metal bars, an angle between the twoadjacent metal bars is smaller than 180 degrees, and the metal bars aresubstantially coplanar.
 19. The method according to claim 16, whereinthe second portion is substantially perpendicular to the first portion.20. The method according to claim 15, wherein the carrier has a paddisposed thereon, and in the step of disposing the metal sheet, themetal sheet is disposed to connect one end of the second portion of themetal sheet to the pad.